by Electrochemical Society in Pennington, NJ (10 S. Main St., Pennington 08534-2896) .
Written in English
|Statement||edited by Vaughn E. Akins, Hiroyuki Harada ; assistant editors, Robert Miller, Mihir Parikh.|
|Series||Proceedings ;, v. 91-5, Proceedings (Electrochemical Society) ;, v. 91-5.|
|Contributions||Akins, Vaughn E., Harada, Hiroyuki., Electrochemical Society. Electronics Division., Electrochemical Society. Dielectric Science and Technology Division.|
|LC Classifications||TK7874 .S884 1990|
|The Physical Object|
|Pagination||vii, 413 p. :|
|Number of Pages||413|
|LC Control Number||91070972|
An integrated circuit or monolithic integrated circuit (also referred to as an IC, a chip, or a microchip) is a set of electronic circuits on one small flat piece (or "chip") of semiconductor material that is normally integration of large numbers of tiny MOS transistors into a small chip results in circuits that are orders of magnitude smaller, faster, and less expensive than those. Conference papers and proceedings Electronic book Congresses: Additional Physical Format: Print version: International Symposium on the Physical & Failure Analysis of Integrated Circuits (7th: Singapore). Proceedings of the 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA ' Author of Conference proceedings, DIPED, Proceedings of the 7th International Symposium on the Physical & Failure Analysis of Integrated Circuits [IPFA '99, GaAs IC Symposium, ASMC , International Symposium on Power Semiconductor Devices and ICs (Ispsd) Proceedings, Intenational Electron Devices Meeting (Iedm) Proceedings, IEEE International Integrated Reliability . R. Hentschke, G. Flach, F. Pinto, and R. Reis, "Quadratic Placement for 3D Circuits Using Z-Cell Shifting, 3D Iterative Refinement and Simulated Annealing," Proceedings of the ACM International Symposium on Integrated Circuits and System Design, pp. , September Google Scholar.
Compound Semiconductor Integrated Circuit Symposium (CSICS), IEEE ; Compound Semiconductor Integrated Circuit Symposium, IEEE Proceedings of the IEEE Sixth Working Conference on ; Current Trends in Information Technology (CTIT), International Conference on the Electronic Manufacturing Technology Symposium (IEMT. P.J. Spletter and R.T. Crowley, “A Laser Based System for Tape Automated Bonding to Integrated Circuits”, Proceedings of the 40th IEEE Electronic Components and Technology Conference, pp. , Google Scholar. Plasma processing has been a key technology for large-volume integrated circuit manufacturing for more than 30 years. In particular, various configurations of plasma reactors, along with a range of plasma chemistries, have enabled high-throughput anisotropic and selective etching of materials with attendant precision transfer of resist patterns. ISTFA™ - Conference Proceedings from the 40th International Symposium for Testing and Failure Analysis, November 9–13, , George R. Brown Convention Center, Houston, Texas, USA Details This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community.
Nanowire Transistors - by Jean-Pierre Colinge April F. Tissafi-Drissi, I. O'Connor, F. Mieyeville, F. Gaffiot, "Design methodologies for high-speed CMOS photoreceiver front-ends," 16th Symposium On Integrated Circuits And System Design, pp. , Sao Paolo, Brazil, September Abstract. Globalization of semiconductor manufacturing has brought about increasing concerns regarding possible infiltration of the Integrated Circuit (IC) supply chain by skilled and resourceful adversaries, with the intention of introducing malicious modifications (a.k.a hardware Trojans) which can be exploited to cause incorrect results, steal sensitive data, or even incapacitate a chip. The production of Integrated Circuits (IC) is a detailed and exacting process requiring tight specifications and precise equipment. The high cost and unique traits of this equipment requires high.